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P1(S55C)

  • S55C-2
  • P1
S55C-2 P1
Details
S55C

 
Chemical Composition%:

C Si Mn Cr S P
0.52-0.60 0.15-0.35 0.5-0.8 0.3-0.4 0.03 0.03
 
Material Feature:
►It can be used in large plastic mold for the products such as bumper, the case of office machinery and equipment,
   electric product, toy, household items and etc.
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